REHM VSX nitro reflow furnace, ASM SiPlace SX2 high speed Pick & Place
(59.000 electronic components / hour)
Automated Solder/ Sinterpaste inspection line, ASYS Ekra X5 professional Printer with Viscom S3088 SPI system and automatic feeding system
ASM/ DEK Horizon 01i automatic printer, ASYS EKRA E4 Printer for long term printing
Keyence VHX1000 digital microscope for visual inspection
GE Phoenix micromex 180 x-ray inspection system with tomography option
ASM/ DEK Horizon 03iX automatic paste printing system
BESI Datacon 2200EVO die bonder and pick and place system
Heated pick and place process with max.10 kg force
Boschman Sinterstar Sinter press for Sintering in ambient air and under Nitrogen protective Atmosphere. Sintering with Flat and Dynamic Insert Tool. Max Temp. 300 °C, Max. Force 175 KN
PINK Sinterpress SIN200 with soft silicone tool for pressure transfer, adjustable atmosphere (vacuum, nitrogen, air)
Max Temp. 300 °C, Max. force 2000 KN Cooling station with adjustable atmosphere next to sinter module.
PINK VADU200XL vacuum soldering system, capable of operation under formic acid and forming gas Atmosphere, Tmax 400 °C.
PbT SuperSwash flux cleaning equipment
K&S 3600 plus (left) and Asterion wedge-wedge bonders for application of Al, CucorAl and PowerCu soft wires as well as ribbon contact materials.
Hübers e1121 vacuum potting equipment for vacuum processing and potting of hard and soft encapuslation materials.
DAGE 4000 shear tester with 100 kg and maximum 200 kg test head. Hot Die Shear test possible
PVA Tepla SAM300 scanning accoustic microscope for measurement of layers 20-20000 µm
