Sinter paste for System-IN-Package Applications

SiP webinar on July 30th, 2020 - Dennis Ang

5G open doors to new possibilities featuring higher bandwidth and increased capacity. To harness the benefits of these network improvements, new switching devices designed with wide band gap semiconductor technologies like GaN are necessary. The faster switching speed drives up operating temperature. Traditional die attach material are operating at its limit. In order to maintain system reliability, sintering has high interest as the alternate thermal management solution. We would share about our new non-pressure sinter paste DA295A and its performance properties to support expansion of 5G technologies.

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