Solder Solutions for System-IN-Package Applications

SiP webinar on July 30th, 2020 - Li-San Chan

Reliability of interconnects of solder joints play an increasing role in System-in-Package applications for 5G applications. The complexity of miniaturization and packing density add to the challenge when selecting a suitable solder material. Critical performance such as voids, bridging and solder volume consistency must meet stringent requirements. This presentation will discuss the fundamentals of solder paste formulation; and comparing the performance of various materials. A new All-in-One Printing concept will also be introduced; where customers can achieve higher device yield while lowering stencil and equipment costs; and increasing throughput.

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