Join Heraeus Electronics at APEX 2023

Heraeus at SEMICON Korea 2023​

For the first time, Heraeus Electronics will be exhibiting at SEMICON Korea. With 5G, Internet of things (IoT), and Artificial Intelligence (AI) continue to disrupt and shape the semiconductor industry, new innovative material solutions are required to support the next generation packages. Are you interested to know how Heraeus Electronics’ latest materials portfolio enables you to develop new keys for higher current density, addressing integration challenges, and answering the demand for improved reliability, miniaturization and cost efficiency?

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Stop by at our booth and talk to our experts:

  • Exhibition date: 1 - 3 February 2023
  • Heraeus Booth No. C762 ꟾ Hall C​
  • Venue: COEX Convention & Exhibition Centre

 More information about SEMICON Korea

New product highlights for semiconductor packaging

mAgic™ DA320 non-pressure sinter paste

For RF amplifier and power discrete

Key benefits

  • Non-pressure sinter at 200°C and above
  • High shear strength above 50 MPa
  • Thermal conductivity above 200 W/mK
  • 90 mins fast sintering
  • Low porosity

 Find out more

Welco® AP520

For next generation ultra-fine pitch SiP application

Key benefits

  • Consistent paste release down to 90um pitch
  • Best-in-class low void performance
  • No splashing and minimal beading

 Find out more

AP500X water soluble flux

For ultra-fine bump pitch flip chip attach and BGA attach applications

Key benefits

  • Enables ultra-fine bump pitch flip chip attach with zero defects
  • Superior wettability
  • Effective removal of OSP layer on Cu OSP pads

 Find out more

  • Welco™ solder paste series made with 100% recycled TIN​
  • Gold bonding wire made ​with 100% recycled GOLD​