Date: 11 - 13 July 2023
Exhibition Location: Moscone Center, San Francisco, CA 94103
Booth number: #5862
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July 11 - 13, Moscone Center, San Francisco, CA
Heraeus Electronics at SEMICON West 2023
Today’s electronics devices need to deliver more functionality with more processing power and greater speed. Module complexity is increasing, while devices have to miniaturize. Heraeus as a solution provider for the advanced packaging market offers materials for outstanding reliability, best performance and at the same time lower costs. Durability and service excellence increased.
Semicon West 2023 event information
Our product highlights
AgCoat Prime: Gold-Coated Silver Bonding Wire
mAgic® PE338: Pressure Ag Sinter Paste for Power Electronics Applications
AP500X Water Soluble Flux for Ultra-Fine Bump Pitch Flip Chip Attach and BGA Attach Applications
AP520 T7 Water Soluble Solder Paste
PE401Copper Pressure Sinter Paste
AgCoat® Prime: Gold-Coated Silver Bonding Wire
Key benefits:
- Gas-free FAB formation in bonding process
- Longer floor life (60 days) compared to Ag alloy wire
- Improves second bond workability
- Improved reliability performance on HTS and TC compared to Au wire
- Retain your existing facility infrastructure to avoid any CAPEX investment
- Reuse of existing ball bonders in your production floor
- Slower IMC growth rate compared to Au wire
mAgic® PE338: Pressure Ag Sinter Paste for Power Electronics Applications
Key benefits:
- Improves device reliability
- High thermal conductivity for longer lifetime
- High electrical conductivity improves device efficency
- Enables high operating temperature
- Lead-free and halogen zero formulation for environmental compliance
- No flux residue, no cleaning required
- Consistent printing performance
- Long stencil life
AP500X:Water Soluble Flux for Ultra-Fine Bump Pitch Flip Chip Attach and BGA Attach Applications
Key benefits:
- Water-soluble
- Halogen zero
- Superior wettability
- ≥12hr work life
- Effective removal of OSP layer on Cu OSP pads
- Enables ultra-fine bump pitch flip chip attach with zero defects
WelcoTM AP520 T7 Water Soluble Solder PasteFor next generation ultra fine pitch SiP applications (NEW!)
Key benefits:
- Fewer processing steps- lower CAPEX, labor and material costs
- Solder paste eliminates “white bond”, incomplete solder formation (due to substrate unevenness and/ or uneven Cu pillar heights)
- Reduce non-wet defects as much as 600 times
PE401Copper Pressure Sinter Paste
Key benefits:
- Good printability on fine pitch pad size
- Minimal solder splashing
- Good wetting performance
- Good cleaning properties
- Halogen-free
- Available in low alpha count SAC 305 alloy T6 and T7
- Available in Type 4 to 7 powders