Engineered primarily for mini and micro-LED die attach applications for products like tablets, TVs, or videowalls.
WelcoTM LED120: T7 SAC305 No-Clean Printing Paste
Given higher resolution, enhanced brightness, better contrast, and longer work life compared to traditional LEDs or other display technologies, mini and micro-LEDs are increasingly used in backlights or displays for consumer products such as tablets, TVs, or videowalls. To provide premium performance, quality, and reliability, mini-LED die attach materials and processes must overcome challenges as defined by the extremely small die size.
The new WelcoTM LED120 Type 7 paste is especially engineered to print consistently and accurately onto extremely small substrate pads of <100µm to attach mini-LED dies. The paste release performance is exceptional at 70µm stencil openings and highly consistent over its long stencil life.
WelcoTM LED120 series uses Heraeus proprietary WelcoTM Type 7 powders to enable extremely reliable solder joints - consistent solder volume without bridging or missing dots, best-in-class low void performance, and most importantly, proven reliability (e.g. shear strength) for mini and micro-LED applications.
Key Features
- Incorporates high-quality WelcoTM T7 SAC305 powders
- Narrow size distribution
- Uniform spherical shapes
- Batch-to-batch consistency
- Halogen-free and No-clean chemistry
- Best-in-class low-void performance
- Minimal solder beading
- Consistent fine pitch paste release
- Long stencil life (≥10hr) & staging life (≥10hr)
- Proven reliability and shear strength in miniLED application