mAgic™ DA320 non-pressure sinter paste

For RF amplifier and power discrete

Key benefits

• Non-pressure sinter at 200°C and above
• High shear strength above 50 MPa
• Thermal conductivity above 200 W/mK
• 90 mins fast sintering
• Low porosity

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Welco® AP520

For next generation ultra-fine pitch SiP application

Key benefits

• Consistent paste release down to 90um pitch
• Best-in-class low void performance
• No splashing and minimal beading

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AP500X water soluble flux

For ultra-fine bump pitch flip chip attach and BGA attach applications

Key benefits

• Enables ultra-fine bump pitch flip chip attach with zero defects
• Superior wettability
• Effective removal of OSP layer on Cu OSP pads

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• Welco™ solder paste series made with 100% recycled TIN​
• Gold bonding wire made ​with 100% recycled GOLD​