5033344 - 可烧结表面贴装 RTD (SMD-SC) 元件

功率电子技术代表了可烧结温度传感器的主要应用重点. 大规模生产, 精确化, 长期稳定性和低成本是其设计的方向. 该设计允许直接对热源/未封装芯片进行可能的灵活定位. 顶面的金属化适用于粗线粘合, 背面的设计适用于银烧结工艺, 两侧 (金属化) 相互电气隔离.

技术参数

  • 类型: SMD 1206 SC 烧结
  • 公称阻值 R₀ [Ω]: Pt1000
  • 温度系数(TCR): 3850
  • 公差等级: F 0.6 (2B)
  • 最低温度 °C: -50
  • 最高温度 °C: 200
  • 最低温度误差 °C: -50
  • 最高温度误差 °C: 200
  • 尺寸 [mm] (L₁xWxH): 3.1 / 1.5 / 0.55
  • 长度₂ (mm): 0.79
  • 包装技术: 芯片背部适用于烧结工艺, 实现热传递的优化; 顶部可适用超声波焊接技术
  • 绝缘阻抗: > 1000 MΩ 在 20 °C
  • 顶面金属化(邦定): 邦定: AgPt表面厚膜技术可用于粗丝的超声焊接工艺.
    推荐: 贺利氏Al H11粗丝(Ø 300µm).
    当前内部测试均基于上述邦定线完成
  • 背面金属化(烧结): 烧结: AgPd表面厚膜技术可用于烧结银工艺.
    贺利氏烧结膏(ASP 338和043系列)
    所有测试均使用推荐的膏体进行.
  • 背面剪切测试/烧结: 烧结
    > 10 N/mm2 (单一值)
    > 20 N/mm2 (平均值)
  • 顶面拉力测试/邦定: 邦定
    > 210 cN (等于Al H11粗线75 %负载极限 ø =300 µm )
  • 自热: < 0.4 K/mW (未封装)
  • 保质期: 原装未开封 (至少半年)

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