5033344 - Sinterable Surface-Mounted RTD (SMD-SC) Element

电力电子技术代表了可烧结温度传感器的应用重点。大规模生产、精确化、长期稳定性和低成本是其设计的重点。顶面的金属化适合于粗线粘合,背面的设计适合于银烧结工艺。两侧(金属化)相互电气隔离。

5033344

技术参数

  • 类型: SMD 1206 SC
  • 公称阻值 R₀ [Ω]: Pt1000
  • 温度系数(TCR): 3850
  • 公差等级: F 0.6 / 2B
  • 最低温度 °C: -50
  • 最高温度 °C: 200
  • 最低温度误差 °C: -50
  • 最高温度误差 °C: 200
  • 尺寸 [mm] (L₁xWxH): 3.1 / 1.5 / 0.55
  • 长度₂ (mm): 0.79
  • 包装技术: 适用于背部烧结,优化传热,以及顶部超声波焊接
  • 绝缘阻抗: > 1000 MΩ at 20 °C
  • 顶面金属化(邦定): AgPt表面厚膜技术可用于粗丝的超声焊接工艺。 推荐:贺利氏Al H11粗丝(Ø 300µm)。所有测试都是使用建议的钢丝完成。
  • 背面金属化(烧结): AgPd表面厚膜技术可用于银的烧结工艺。贺利氏烧结膏(ASP 338和043系列)所有试验均采用推荐膏体进行。
  • 背面剪切测试/烧结: > 10 N/mm2 (单一值) > 20 N/mm2 (平均值)
  • 顶面拉力测试/邦定: > 210 cN (等于Al H11粗丝75%负载极限 ø =300 µm )
  • 自热: < 0.4 K/mW (未装配)
  • 保质期: 原装未开封(至少6个月以上)

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